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S32G274AABK0CUCT - NXP

Description: ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 4 Core, 64-Bit/3 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

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PCB Footprints
S32G274AABK0CUCT - NXP PCB footprint - BGA - BGA - SOT1655-3
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3D Models
S32G274AABK0CUCT - NXP  - 3D model - BGA - SOT1655-3
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S32G274AABK0CUCT Details

  • Manufacturer Part Number:

    S32G274AABK0CUCT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FCBGA-525

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B525

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    525

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA525,23X23,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100; ISO 26262-ASIL D

  • Seated Height-Max:

    2.12 mm

  • Supply Voltage-Max:

    0.87 V

  • Supply Voltage-Min:

    0.72 V

  • Supply Voltage-Nom:

    0.77 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

S32G274AABK0CUCT Frequently Asked Questions (FAQs)

  • NXP provides a PCB layout guide and thermal management guidelines in the S32G274A application note (AN12213) and the S32G reference manual (RM0056). It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • To optimize power consumption, use the low-power modes (e.g., Wait, Stop, and VLP) and adjust the clock frequencies according to your application's requirements. Additionally, use the Power Management Unit (PMU) to control the power domains and reduce power consumption in unused peripherals. Refer to the S32G274A power management application note (AN12214) for more information.
  • To design a robust and reliable system, ensure that your design meets the recommended operating conditions, follows proper PCB layout and thermal management guidelines, and implements error detection and correction mechanisms (e.g., ECC, CRC, and watchdog timers). Additionally, perform thorough testing and validation to ensure that your system can withstand environmental stressors and faults.
  • Use the S32G274A's built-in security features, such as the Boot ROM and Secure Boot mechanism, to ensure secure boot and firmware updates. Implement secure firmware update protocols, such as those using digital signatures and encryption, to prevent unauthorized access and ensure the integrity of your firmware.
  • NXP provides a range of development tools, including the S32 Design Studio (a free IDE), the S32G274A evaluation board, and the MCUXpresso software development kit (SDK). Additionally, third-party software frameworks, such as AUTOSAR and Linux, are available for the S32G274A.

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S32G274AABK0CUCT Overview

Use the download button to access the S32G274AABK0CUCT schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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