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S32K358GHT1MPCST - NXP

Description: S32K358 Arm Cortex-M7, 240 MHz, 8 MB Flash, CAN FD, HSE B security, 172 HDQFP – S32K MCUs for General Purpose, -40°C ~ 125°C

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PCB Footprints
S32K358GHT1MPCST - NXP PCB footprint - Other - Other - SOT2098-1_2025-1
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3D Models
S32K358GHT1MPCST - NXP  - 3D model - Other - SOT2098-1_2025-1
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S32K358GHT1MPCST Details

  • Manufacturer Part Number:

    S32K358GHT1MPCST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G172

  • Length:

    16 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    16

  • Number of Terminals:

    172

  • Number of Timers:

    6

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP172,.75SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    1179648

  • ROM (words):

    8388608

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.75 mm

  • Speed:

    120 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

S32K358GHT1MPCST Frequently Asked Questions (FAQs)

  • NXP provides a PCB layout guide and thermal management guidelines in the S32K3xx MCU Family PCB Design Guidelines document (S32K3XX_PCB_Design_Guidelines.pdf) and the S32K3xx MCU Family Thermal Design Guidelines document (S32K3XX_Thermal_Design_Guidelines.pdf). These documents provide detailed recommendations for PCB layout, thermal vias, and heat sink design to ensure optimal performance and thermal management.
  • NXP provides a Power Consumption Analysis document (S32K3XX_Power_Consumption_Analysis.pdf) that provides detailed information on the power consumption of each module and peripheral. Additionally, the S32K3xx MCU Family Power Management Application Note (S32K3XX_Power_Management_AN.pdf) provides guidelines on how to optimize power consumption for specific applications. Engineers can also use the NXP Power Estimation Tool (PET) to estimate power consumption based on their specific use case.
  • NXP provides a Clock and PLL Configuration Application Note (S32K3XX_Clock_PLL_Config_AN.pdf) that provides detailed information on the recommended settings for the clock and PLL configuration. Additionally, the S32K3xx MCU Family Reference Manual (S32K3XX_RM.pdf) provides detailed information on the clock and PLL architecture and configuration options.
  • NXP provides a Secure Boot and Secure Firmware Update Application Note (S32K3XX_Secure_Boot_FW_Update_AN.pdf) that provides guidelines on how to implement secure boot and secure firmware updates using the device's built-in security features, such as the Boot Assist Module (BAM) and the Secure Firmware Update (SFU) module.
  • NXP provides a Debug and Test Application Note (S32K3XX_Debug_Test_AN.pdf) that provides guidelines on how to use the device's built-in debugging and testing features, such as the Debug Module (DM) and the Joint Test Action Group (JTAG) interface. Additionally, NXP recommends using third-party debugging tools, such as the Lauterbach TRACE32 or the P&E Microcomputer Systems Multilink, to debug and test the device.

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S32K358GHT1MPCST Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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