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S32K358GHT1VPCST - NXP

Description: ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit Tri-Core 240MHz 8MB (8M x 8) FLASH 172-QFP-EP

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S32K358GHT1VPCST - NXP - PCB symbol
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PCB Footprints
S32K358GHT1VPCST - NXP PCB footprint - Other - Other - SOT2098-1_2025-1.2
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S32K358GHT1VPCST - NXP - 3D model - Other - SOT2098-1_2025-1.2
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S32K358GHT1VPCST Details

  • Manufacturer Part Number:

    S32K358GHT1VPCST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFP-172

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G172

  • Length:

    16 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    16

  • Number of Terminals:

    172

  • Number of Timers:

    6

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP172,.75SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    1179648

  • ROM (words):

    8388608

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.75 mm

  • Speed:

    120 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

S32K358GHT1VPCST Frequently Asked Questions (FAQs)

  • NXP provides a PCB layout guide and thermal management guidelines in the S32K3xx MCU Family PCB Design Guidelines document (AN12213). It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • NXP provides a power consumption optimization guide in the S32K3xx MCU Family Power Consumption Optimization document (AN12214). It covers techniques such as clock gating, voltage scaling, and peripheral power management to minimize power consumption.
  • NXP provides guidelines for crystal oscillator settings in the S32K3xx MCU Family Oscillator Design Guide document (AN12215). The recommended settings depend on the specific crystal oscillator used and the desired frequency accuracy.
  • NXP provides EMC guidelines and design recommendations in the S32K3xx MCU Family Electromagnetic Compatibility (EMC) document (AN12216). It covers topics such as PCB layout, shielding, and filtering to minimize electromagnetic interference.
  • The S32K358GHT1VPCST is rated for operation up to 125°C. However, NXP recommends following the guidelines in the S32K3xx MCU Family High-Temperature Operation document (AN12217) to ensure reliable operation in high-temperature environments. This includes derating the clock frequency and voltage, and using thermal management techniques.

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S32K358GHT1VPCST Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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