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S3A - onsemi

Description: 50V, 3A RECT, SMC, GL PS

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S3A - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - S3A
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S3A - onsemi  - 3D model - Diodes Moulded - S3A
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S3A Details

  • Manufacturer Part Number:

    S3A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    61 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.22

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.15 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    2.6 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL CERTIFIED

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    2.5 µs

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S3A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to the ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Not using a heat sink can lead to reduced reliability, increased thermal resistance, and decreased performance. The device may not be able to operate at its maximum ratings, and its lifespan may be reduced.
  • Yes, but it's essential to ensure that the device is properly sealed and protected from moisture. Apply a conformal coating to the PCB, and consider using a moisture-resistant package or a hermetically sealed device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Ensure that the PCB is designed with ESD protection in mind, and follow proper handling and storage procedures to prevent ESD damage.

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S3A Overview

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Part Image ES3AHE3_A/H Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 3A, 50V V(RRM), Silicon, DO-214AB

Part Image GR3A Surge Components Inc

Rectifier Diode, 1 Phase, 1 Element, 3A, 50V V(RRM), Silicon, DO-214AB

Part Image FM301-H Formosa Microsemi Co Ltd

Rectifier Diode, 1 Phase, 1 Element, 3A, 50V V(RRM), Silicon, DO-214AB

Part Image ER3A Microsemi Corporation (now Microchip)

Rectifier Diode, 1 Phase, 1 Element, 3A, 50V V(RRM), Silicon, DO-214AB

Part Image S3A Microsemi Corporation (now Microchip)

Rectifier Diode, 1 Phase, 1 Element, 3A, 50V V(RRM), Silicon, DO-214AB, SMCJ, 2 PIN

For a full list of alternate parts for S3A, check out Findchips.com