A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to the ground plane to dissipate heat efficiently.
To ensure stability, a minimum output capacitance of 10uF with an ESR of 1ohm or less is recommended. Additionally, a 1uF ceramic capacitor should be placed close to the VIN pin to filter high-frequency noise.
The maximum input voltage that S3J can withstand without damage is 28V. Exceeding this voltage may cause permanent damage to the device.
The power dissipation of S3J can be calculated using the formula: Pd = (VIN - VOUT) x IOUT. Where VIN is the input voltage, VOUT is the output voltage, and IOUT is the output current.
A 10uF to 22uF ceramic capacitor with an X5R or X7R dielectric is recommended for the input capacitor. This value provides a good balance between input ripple rejection and stability.
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