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S3J - onsemi

Description: Glass passivated junction.; Low profile package.

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PCB Footprints
S3J - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC (DO-214AB)
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S3J - onsemi  - 3D model - Diodes Moulded - SMC (DO-214AB)
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S3J Details

  • Manufacturer Part Number:

    S3J

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Manufacturer Package Code:

    403AG

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.15 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    2.6 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    2.5 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S3J Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to the ground plane to dissipate heat efficiently.
  • To ensure stability, a minimum output capacitance of 10uF with an ESR of 1ohm or less is recommended. Additionally, a 1uF ceramic capacitor should be placed close to the VIN pin to filter high-frequency noise.
  • The maximum input voltage that S3J can withstand without damage is 28V. Exceeding this voltage may cause permanent damage to the device.
  • The power dissipation of S3J can be calculated using the formula: Pd = (VIN - VOUT) x IOUT. Where VIN is the input voltage, VOUT is the output voltage, and IOUT is the output current.
  • A 10uF to 22uF ceramic capacitor with an X5R or X7R dielectric is recommended for the input capacitor. This value provides a good balance between input ripple rejection and stability.

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S3J Overview

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Part Image S3JHR6G Taiwan Semiconductor

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Part Image S3J-G Sangdest Microelectronics (Nanjing) Co Ltd

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