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S4008VTP - LITTELFUSE

Description: SCRs SCR 400V 8A TO251

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Symbol
S4008VTP - LITTELFUSE - PCB symbol
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PCB Footprints
S4008VTP - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-251AA (V/I-Package) — V/I-PAK Through Hole
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3D Models
S4008VTP - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-251AA (V/I-Package) — V/I-PAK Through Hole
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S4008VTP Details

  • Manufacturer Part Number:

    S4008VTP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-251AA

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.92

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    250 V/us

  • DC Gate Trigger Current-Max:

    15 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    30 mA

  • JEDEC-95 Code:

    TO-251AA

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.5 mA

  • Non-Repetitive Pk On-state Cur:

    100 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    5100 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • RMS On-state Current-Max:

    8 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    400 V

  • Repetitive Peak Reverse Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S4008VTP Frequently Asked Questions (FAQs)

  • Littelfuse recommends a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • Littelfuse recommends using a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. The device should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for proper wetting and filleting.
  • The S4008VTP has a maximum surge current rating of 100 A, 8/20 μs waveform, as per IEC 61000-4-5. This rating is in addition to the device's continuous current rating of 40 A.
  • Yes, the S4008VTP is suitable for high-frequency applications up to 100 kHz. However, the device's impedance and insertion loss should be considered in the design, and the application should be evaluated for potential resonance and oscillation.
  • In a fault condition, the S4008VTP is designed to fail in a safe and predictable manner. The device will typically exhibit a low impedance path to ground, allowing the fault current to be safely diverted to ground. The device's thermal protection will also activate to prevent overheating and reduce the risk of fire or electrical shock.

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S4008VTP Overview

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