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S4055NRP - LITTELFUSE

Description: SCRs 55A 400V

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Symbol
S4055NRP - LITTELFUSE - PCB symbol
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PCB Footprints
S4055NRP - LITTELFUSE PCB footprint - Other - Other - S4055NRP
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3D Models
S4055NRP - LITTELFUSE - 3D model - Other - S4055NRP
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S4055NRP Details

  • Manufacturer Part Number:

    S4055NRP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Package Description:

    ROHS COMPLIANT, PLASTIC, D2PAK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    550 V/us

  • DC Gate Trigger Current-Max:

    40 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Non-Repetitive Pk On-state Cur:

    650 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • On-state Current-Max:

    35000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    55 A

  • Repetitive Peak Off-state Voltage:

    400 V

  • Repetitive Peak Reverse Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S4055NRP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the S4055NRP is a rectangular pad with a size of 1.5mm x 0.8mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask defined gap of 0.2mm around the pad.
  • To ensure reliable soldering of the S4055NRP, use a soldering iron with a temperature of 250°C to 270°C, and a solder with a melting point of 180°C to 200°C. Apply a small amount of solder paste to the PCB pad, and use a gentle touch to avoid damaging the component.
  • The maximum operating temperature range for the S4055NRP is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Yes, the S4055NRP is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
  • To prevent electrostatic discharge (ESD) damage, handle the S4055NRP with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the component's pins or leads, and use ESD-safe packaging and storage materials.

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S4055NRP Overview

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