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S5M - Diotec

Description: Rectifiers Diode, SMC, 1000V, 5A

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Symbol
S5M - Diotec - PCB symbol
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PCB Footprints
S5M - Diotec PCB footprint - Diodes Moulded - Diodes Moulded - S5M___
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3D Models
S5M - Diotec - 3D model - Diodes Moulded - S5M___
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S5M Details

  • Manufacturer Part Number:

    S5M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    1.5 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S5M Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure good airflow and avoid blocking airflow around the device.
  • Handle the device by the body, avoiding touching the pins. Store the device in an anti-static bag or wrap it in anti-static material. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures.
  • Check the input voltage, current, and temperature. Verify the PCB layout and thermal management. Use an oscilloscope to analyze the input and output waveforms. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, ensure proper PCB layout and routing to minimize EMI. Use a common-mode choke or ferrite bead on the input lines. Add a shield or metal can to the device if necessary. Follow the guidelines in the datasheet and relevant industry standards.

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S5M Overview

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