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S6006VS3TP - LITTELFUSE

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S6006VS3TP Details

  • Manufacturer Part Number:

    S6006VS3TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-251AA

  • Package Description:

    ROHS COMPLIANT, PLASTIC, V/IPAK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.33

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    8 V/us

  • DC Gate Trigger Current-Max:

    0.5 mA

  • DC Gate Trigger Voltage-Max:

    0.8 V

  • Holding Current-Max:

    8 mA

  • JEDEC-95 Code:

    TO-251AA

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.25 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    6000 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    6 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S6006VS3TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and ensuring a minimum of 1oz copper thickness. Additionally, it's recommended to have a solid copper fill on the top and bottom layers to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the device, and avoid applying excessive force or pressure during the soldering process.
  • The maximum allowed voltage transient for the S6006VS3TP is 1.5 times the maximum rated voltage (Vdrm) for a duration of up to 100ms. However, it's recommended to consult the datasheet and application notes for specific guidance on voltage transients and surge protection.
  • Yes, the S6006VS3TP is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is designed to withstand harsh environmental conditions. However, it's essential to consult the datasheet and application notes for specific guidance on qualification, testing, and validation.
  • To calculate the power dissipation, use the formula Pd = (Vdrm x Idrm) / Rthja, where Pd is the power dissipation, Vdrm is the maximum rated voltage, Idrm is the maximum rated current, and Rthja is the thermal resistance from junction to ambient. The junction temperature can be calculated using the formula Tj = Ta + (Pd x Rthja), where Ta is the ambient temperature.

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S6006VS3TP Overview

Use the download button to access the S6006VS3TP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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