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S6015LTP - LITTELFUSE

Description: SCRs 600V 15A

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Symbol
S6015LTP - LITTELFUSE - PCB symbol
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PCB Footprints
S6015LTP - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB (L-Package
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3D Models
S6015LTP - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-220AB (L-Package
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S6015LTP Details

  • Manufacturer Part Number:

    S6015LTP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.43

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    325 V/us

  • DC Gate Trigger Current-Max:

    30 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    40 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-Repetitive Pk On-state Cur:

    225 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    15 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S6015LTP Frequently Asked Questions (FAQs)

  • A good PCB layout for the S6015LTP should include a large copper pad for heat dissipation, with multiple vias connecting to a solid ground plane. This helps to reduce thermal resistance and improve overall thermal performance.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the component. Avoid overheating or applying excessive force, which can damage the device.
  • For high-reliability applications, consider the device's derating, thermal management, and electrical overstress protection. Ensure that the device operates within its recommended specifications, and implement adequate protection against electrical surges and transients.
  • The S6015LTP is rated for operation up to 150°C. However, for high-temperature environments, consider the device's thermal derating, and ensure that the PCB and surrounding components can withstand the elevated temperatures.
  • To troubleshoot issues with the S6015LTP, start by verifying the device's pinout and connections. Check for signs of physical damage, overheating, or electrical overstress. Use a multimeter to measure voltage and current, and consult the datasheet for guidance on troubleshooting common issues.

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S6015LTP Overview

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