A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat. The copper area should be at least 1 inch² (6.45 cm²) and connected to a ground plane to ensure good heat dissipation.
Use a soldering iron with a temperature of 250°C to 270°C (482°F to 518°F) and a solder with a melting point of 180°C to 190°C (356°F to 374°F). Apply a small amount of solder to the thermal pad and reflow it according to the recommended soldering profile.
The S602ESRP can withstand surge currents up to 100 A for 8/20 μs according to IEC 61000-4-5. However, the actual surge current rating may vary depending on the specific application and environmental conditions.
The S602ESRP is rated for operation up to 150°C (302°F). However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's current rating by 1.5% per degree Celsius above 125°C (257°F).
Select a fuse with a current rating that is at least 1.5 times the maximum expected current in the circuit. Consider factors such as ambient temperature, circuit inductance, and fault current when selecting a fuse.
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