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S70FL01GSAGMFV010 - Infineon

Description: 1 Gbit (128 Mbyte) FL-S Flash SPI Multi-I/O, 3.0 V

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S70FL01GSAGMFV010 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SO-16
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S70FL01GSAGMFV010 - Infineon  - 3D model - Small Outline Packages - SO-16
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S70FL01GSAGMFV010 Details

  • Manufacturer Part Number:

    S70FL01GSAGMFV010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.0006 A

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    7.5 mm

  • Write Protection:

    HARDWARE/SOFTWARE

S70FL01GSAGMFV010 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for the S70FL01GSAGMFV010, which includes recommendations for PCB layout, thermal management, and decoupling. It's essential to follow these guidelines to ensure optimal performance, power integrity, and thermal dissipation.
  • Infineon provides a Secure Boot Solution (SBS) for the S70FL01GSAGMFV010, which includes a set of tools and guidelines for implementing secure boot and firmware updates. Additionally, the device supports various cryptographic algorithms and secure protocols, such as AES, SHA, and TLS.
  • The S70FL01GSAGMFV010 has an internal POR and BOD circuitry. The POR threshold is typically around 1.7V, and the BOD threshold is around 2.2V. However, it's recommended to consult the device's errata sheet and application notes for specific implementation details and any potential limitations.
  • The S70FL01GSAGMFV010 has various power-saving features, such as dynamic voltage and frequency scaling, idle modes, and power gating. To optimize power consumption, it's essential to understand the device's power modes, use the lowest possible voltage and frequency, and implement power-saving techniques in the firmware.
  • The S70FL01GSAGMFV010's ADC has a 12-bit resolution and a maximum sampling rate of 1 MSPS. However, it's essential to consider the ADC's input impedance, noise tolerance, and calibration requirements to ensure accurate conversions. Additionally, the ADC's performance may be affected by temperature, voltage, and clock frequency.

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