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S70FL01GSDPBHVC10 - Infineon

Description: NOR Flash Nor

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S70FL01GSDPBHVC10 - Infineon PCB footprint - BGA - BGA - 24-Ball BGA 8 x 6 mm (ZSA024)
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S70FL01GSDPBHVC10 - Infineon  - 3D model - BGA - 24-Ball BGA 8 x 6 mm (ZSA024)
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S70FL01GSDPBHVC10 Details

  • Manufacturer Part Number:

    S70FL01GSDPBHVC10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    66 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.0006 A

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

S70FL01GSDPBHVC10 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN2013-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The S70FL01GSDPBHVC10 has a thermal pad on the bottom side, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, Infineon recommends using a heat sink or thermal interface material to further improve thermal management.
  • The S70FL01GSDPBHVC10 is rated for operation from -40°C to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C to ensure reliability and prevent damage.
  • The S70FL01GSDPBHVC10 can be programmed using Infineon's FlashFX Pro software tool, which provides a graphical user interface for programming and debugging the device. The tool is available for download on Infineon's website.
  • Infineon recommends a power-up sequence of VCC first, followed by VPP, and then the clock signal. This sequence helps to prevent latch-up and ensures proper device operation.

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