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S70FS01GSAGMFI010 - Infineon

Description: NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 1G/512M/256M x 1/2-bit/4-bit 8ns 16-Pin SOIC W Tray

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S70FS01GSAGMFI010 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead SOIC
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S70FS01GSAGMFI010 - Infineon  - 3D model - Small Outline Packages - 16-Lead SOIC
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S70FS01GSAGMFI010 Details

  • Manufacturer Part Number:

    S70FS01GSAGMFI010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Additional Feature:

    IT ALSO HAVE MEMORY WIDTH X1

  • Alternate Memory Width:

    2

  • Clock Frequency-Max (fCLK):

    133 MHz

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    4

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX4

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

S70FS01GSAGMFI010 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout and thermal management guide in their application note AN2014-01, which includes guidelines for thermal pad connection, PCB thickness, and copper thickness to ensure optimal performance and thermal dissipation.
  • The power-up and power-down sequencing is critical for the device. Infineon recommends following the power-up sequence: VCC, VCCQ, and then VREF. For power-down, the sequence should be reversed. Additionally, ensure that the power supplies are ramped up and down slowly to prevent damage to the device.
  • The input and output capacitors should be selected based on the operating frequency, output current, and voltage ripple requirements. Infineon recommends using X7R or X5R ceramic capacitors with a voltage rating of at least 1.5 times the maximum input voltage. The capacitor values should be chosen to ensure a stable output voltage and minimize voltage ripple.
  • Infineon recommends implementing overcurrent protection using an external current sense resistor and a comparator or a dedicated overcurrent protection IC. For short-circuit protection, a fuse or a PPTC (Polymeric Positive Temperature Coefficient) device can be used. The specific implementation details depend on the application requirements and should be carefully evaluated to ensure reliable operation.
  • For high-power applications, thermal design is critical. Infineon recommends using a heat sink with a thermal resistance of less than 10°C/W, and ensuring good thermal contact between the device and the heat sink. The PCB should be designed to minimize thermal resistance, and thermal vias should be used to dissipate heat from the top layer to the bottom layer. Additionally, the device should be placed in a well-ventilated area to ensure adequate airflow.

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Part Image S70FS01GSAGMFI010 Cypress Semiconductor

Flash, 256MX4, PDSO16