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S70KL1282GABHV020 - Infineon

Description: DRAM HyperRAM

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PCB Footprints
S70KL1282GABHV020 - Infineon PCB footprint - BGA - BGA - 24-ball BGA 8.0 mm × 6.0 mm × 1.0 mm (E2A024)
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3D Models
S70KL1282GABHV020 - Infineon  - 3D model - BGA - 24-ball BGA 8.0 mm × 6.0 mm × 1.0 mm (E2A024)
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S70KL1282GABHV020 Details

  • Manufacturer Part Number:

    S70KL1282GABHV020

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.02

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Clock Frequency-Max (fCLK):

    200 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    134217728 bit

  • Memory IC Type:

    PSEUDO STATIC RAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    24

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Standby Current-Max:

    0.00075 A

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

S70KL1282GABHV020 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the S70KL1282GABHV020 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, which is -55°C to 150°C.
  • The power-up and power-down sequences for the S70KL1282GABHV020 should be handled carefully to prevent damage to the device. It's recommended to follow the sequence specified in the datasheet, which involves powering up the VCC supply before the VPP supply, and powering down the VPP supply before the VCC supply.
  • The maximum allowed voltage on the VPP pin of the S70KL1282GABHV020 is 12.5V, as specified in the datasheet. Exceeding this voltage can cause permanent damage to the device.
  • To ensure data retention in the S70KL1282GABHV020 during power-down, it's essential to follow the recommended power-down sequence and ensure that the VCC supply is reduced to 0V before the VPP supply. Additionally, the device should be in a standby or sleep mode before power-down to minimize power consumption.
  • The typical programming time for the S70KL1282GABHV020 depends on the programming method and the size of the data being programmed. According to the datasheet, the typical programming time for a single byte is around 10ms, while the typical programming time for a full sector is around 2.5 seconds.

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