Part Image

S70KS1281DPBHI020 - Infineon

Description: DRAM IC 128 Mb FLASH MEMORY

Download S70KS1281DPBHI020 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
S70KS1281DPBHI020 - Infineon PCB footprint - BGA - BGA - 24-ball 6 *8 *1.0 mm (VAA024)
click to zoom
3D Models
S70KS1281DPBHI020 - Infineon  - 3D model - BGA - 24-ball 6 *8 *1.0 mm (VAA024)
click to zoom

S70KS1281DPBHI020 Details

  • Manufacturer Part Number:

    S70KS1281DPBHI020

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Memory IC Type:

    PSEUDO STATIC RAM

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Temperature Grade:

    INDUSTRIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

S70KS1281DPBHI020 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the S70KS1281DPBHI020 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, which is -55°C to 150°C.
  • The power-up and power-down sequences for the S70KS1281DPBHI020 should be handled carefully to prevent damage or malfunction. It's recommended to follow the power-up sequence: VCC, then VPP, and finally CLK. For power-down, the sequence should be reversed: CLK, then VPP, and finally VCC. Additionally, ensure that the power supply voltage is stable and within the recommended range before applying clock signals.
  • When designing a PCB with the S70KS1281DPBHI020, it's crucial to follow good layout practices to minimize noise, ensure signal integrity, and prevent electromagnetic interference (EMI). Keep the clock signal traces short and away from noisy signals, use decoupling capacitors, and ensure proper grounding and shielding. Additionally, follow the recommended package-specific layout guidelines provided by Infineon.
  • The S70KS1281DPBHI020 has built-in error detection and correction mechanisms, such as ECC (Error-Correcting Code) and CRC (Cyclic Redundancy Check). To implement these mechanisms, refer to the datasheet and application notes provided by Infineon. You may also need to implement additional error detection and correction logic in your system design, depending on the specific requirements of your application.
  • The S70KS1281DPBHI020 has various security features, including secure boot, secure firmware updates, and protection against unauthorized access. To ensure the security of your system, follow the security guidelines and recommendations provided by Infineon, and implement additional security measures as required by your application, such as encryption and secure key management.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

S70KS1281DPBHI020 Overview

Use the download button to access the S70KS1281DPBHI020 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like S70KS, or try a keyword search, such as SRAMs

Parts related to S70KS1281DPBHI020

Showing 0 results