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S8055M - LITTELFUSE

Description: SCR 800V 55A TO218

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Symbol
S8055M - LITTELFUSE - PCB symbol
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PCB Footprints
S8055M - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO- 218AC (K Package)
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3D Models
S8055M - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO- 218AC (K Package)
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S8055M Details

  • Manufacturer Part Number:

    S8055M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-218AC

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • DC Gate Trigger Current-Max:

    40 mA

  • JEDEC-95 Code:

    TO-218AC

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    2

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    55 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Trigger Device Type:

    SCR

S8055M Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the S8055M involves keeping the input and output traces separate, using a ground plane, and minimizing the length of the leads to reduce inductance and noise. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder to the leads. Avoid applying excessive force or heat, which can damage the device. Use a soldering technique that minimizes the risk of bridging or cold joints.
  • The S8055M has an operating temperature range of -40°C to 125°C, but it's recommended to derate the device's performance at temperatures above 85°C to ensure reliable operation.
  • Yes, the S8055M is suitable for high-reliability and safety-critical applications, but it's essential to follow the recommended design and testing guidelines, and to consult with Littelfuse Inc. for specific requirements and certifications.
  • To prevent electrostatic discharge (ESD) damage, handle the S8055M with ESD-protected equipment, wear an ESD wrist strap, and ensure the workspace is ESD-safe. Avoid touching the device's leads or pins, and use ESD-protected packaging and storage.

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S8055M Overview

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