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S80KS2562GABHV020 - Infineon

Description: PSRAM (Pseudo SRAM) Memory IC 256Mbit HyperBus 200 MHz 35 ns 24-FBGA (6x8)

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PCB Footprints
S80KS2562GABHV020 - Infineon PCB footprint - BGA - BGA - 24-ball 6mm x 8mm 1.0 mm (VAA024)
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S80KS2562GABHV020 Details

  • Manufacturer Part Number:

    S80KS2562GABHV020

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    35 ns

  • Clock Frequency-Max (fCLK):

    200 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    PSEUDO STATIC RAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    24

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX16

  • Output Characteristics:

    3-STATE

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Seated Height-Max:

    1 mm

  • Standby Current-Max:

    0.000015 A

  • Standby Voltage-Min:

    1.7 V

  • Supply Current-Max:

    0.022 mA

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

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