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S8GLHE3-TP - MCC

Description: Standard Recovery Rectifiers

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S8GLHE3-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - S8GLHE3-TP
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S8GLHE3-TP - MCC  - 3D model - Diodes Moulded - S8GLHE3-TP
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S8GLHE3-TP Details

  • Manufacturer Part Number:

    S8GLHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.45

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    400 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.05 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

S8GLHE3-TP Frequently Asked Questions (FAQs)

  • The recommended storage temperature range for S8GLHE3-TP is -40°C to 125°C.
  • Yes, the S8GLHE3-TP is compatible with lead-free soldering processes, making it suitable for RoHS-compliant designs.
  • The maximum power dissipation of the S8GLHE3-TP is 1.5W, making it suitable for low-power applications.
  • Yes, the S8GLHE3-TP is designed for high-reliability applications, with a low failure rate and high MTBF (Mean Time Between Failures).
  • Yes, the S8GLHE3-TP is available in tape and reel packaging, making it suitable for automated assembly and high-volume production.

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S8GLHE3-TP Overview

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