Littelfuse recommends a thermal pad with a minimum size of 100mm² and a thickness of 1.5mm to ensure optimal heat dissipation. Additionally, a thermal via array with a minimum of 10 vias is recommended to improve thermal conductivity.
Yes, the S8X8TS1RP is designed to meet the requirements of high-reliability applications. It is built with high-quality materials and undergoes rigorous testing to ensure its performance and reliability in harsh environments.
The S8X8TS1RP is designed to withstand surge currents up to 100A and voltage spikes up to 1500V. Its advanced semiconductor technology and proprietary thermal management system enable it to absorb and dissipate high-energy surges and spikes.
Yes, the S8X8TS1RP is fully compatible with lead-free soldering processes, making it suitable for use in RoHS-compliant applications.
The S8X8TS1RP has a typical response time of less than 1μs to overvoltage and overcurrent conditions, ensuring fast and effective protection of downstream components.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
S8X8TS1RP Overview
Use the download button to access the S8X8TS1RP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like S8X8T,
or try a keyword search, such as Silicon Controlled Rectifiers
Suggested Parts
If you searched for S8X8TS1RP, you might also be interested in these parts: