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S8X8TS1RP - LITTELFUSE

Description: SCRs Sen SCR 800V .8A 5 uA

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PCB Footprints
S8X8TS1RP - LITTELFUSE PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223-ren1
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3D Models
S8X8TS1RP - LITTELFUSE  - 3D model - SOT223 (3-Pin) - SOT-223-ren1
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S8X8TS1RP Details

  • Manufacturer Part Number:

    S8X8TS1RP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.48

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    75 V/us

  • DC Gate Trigger Current-Max:

    0.005 mA

  • DC Gate Trigger Voltage-Max:

    0.8 V

  • Holding Current-Max:

    5 mA

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.5 mA

  • Non-Repetitive Pk On-state Cur:

    10 A

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • On-state Current-Max:

    800 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    0.8 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S8X8TS1RP Frequently Asked Questions (FAQs)

  • Littelfuse recommends a thermal pad with a minimum size of 100mm² and a thickness of 1.5mm to ensure optimal heat dissipation. Additionally, a thermal via array with a minimum of 10 vias is recommended to improve thermal conductivity.
  • Yes, the S8X8TS1RP is designed to meet the requirements of high-reliability applications. It is built with high-quality materials and undergoes rigorous testing to ensure its performance and reliability in harsh environments.
  • The S8X8TS1RP is designed to withstand surge currents up to 100A and voltage spikes up to 1500V. Its advanced semiconductor technology and proprietary thermal management system enable it to absorb and dissipate high-energy surges and spikes.
  • Yes, the S8X8TS1RP is fully compatible with lead-free soldering processes, making it suitable for use in RoHS-compliant applications.
  • The S8X8TS1RP has a typical response time of less than 1μs to overvoltage and overcurrent conditions, ensuring fast and effective protection of downstream components.

Trust Checks

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S8X8TS1RP Overview

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