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S8X8TSRP - LITTELFUSE

Description: SCRs Sen SCR 800V .8A 200 uA

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PCB Footprints
S8X8TSRP - LITTELFUSE PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223-ren1
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3D Models
S8X8TSRP - LITTELFUSE  - 3D model - SOT223 (3-Pin) - SOT-223-ren1
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S8X8TSRP Details

  • Manufacturer Part Number:

    S8X8TSRP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.48

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    75 V/us

  • DC Gate Trigger Current-Max:

    0.2 mA

  • DC Gate Trigger Voltage-Max:

    0.8 V

  • Holding Current-Max:

    5 mA

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.5 mA

  • Non-Repetitive Pk On-state Cur:

    10 A

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • On-state Current-Max:

    800 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    0.8 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S8X8TSRP Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the thermal pad and reflow at 220°C to 240°C for 30-60 seconds.
  • The device can withstand a maximum surge current of 100 A for 10 ms, but this may vary depending on the specific application and environmental conditions.
  • The device is rated for operation up to 150°C, but derating may be necessary for prolonged exposure to high temperatures. Consult the datasheet for specific derating guidelines.
  • Choose a fuse rating that is 1.5 to 2 times the maximum expected current in your application. Consider factors such as inrush current, steady-state current, and fault current when selecting the fuse rating.

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S8X8TSRP Overview

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