A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the thermal pad and reflow at 220°C to 240°C for 30-60 seconds.
The device can withstand a maximum surge current of 100 A for 10 ms, but this may vary depending on the specific application and environmental conditions.
The device is rated for operation up to 150°C, but derating may be necessary for prolonged exposure to high temperatures. Consult the datasheet for specific derating guidelines.
Choose a fuse rating that is 1.5 to 2 times the maximum expected current in your application. Consider factors such as inrush current, steady-state current, and fault current when selecting the fuse rating.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
S8X8TSRP Overview
Use the download button to access the S8X8TSRP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like S8X8T,
or try a keyword search, such as Silicon Controlled Rectifiers