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S912ZVML12F3MKH - NXP

Description: MCU 16-bit S12Z CISC 128KB Flash 5V Automotive 64-Pin HLQFP EP Tray

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PCB Footprints
S912ZVML12F3MKH - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - HLQFP64 (SOT1510-2)
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S912ZVML12F3MKH - NXP  - 3D model - Quad Flat Packages - HLQFP64 (SOT1510-2)
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S912ZVML12F3MKH Details

  • Manufacturer Part Number:

    S912ZVML12F3MKH

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-64

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    MC9S12ZVM

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    2

  • Number of I/O Lines:

    48

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    64

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    8192

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    66 mA

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    3.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

S912ZVML12F3MKH Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the S912ZVML12F3MKH is -40°C to 125°C.
  • The clock settings for the S912ZVML12F3MKH can be configured using the Clock Controller (CLK) module. Refer to the device's reference manual for detailed instructions.
  • The maximum frequency of the S912ZVML12F3MKH is 150 MHz.
  • The ADC on the S912ZVML12F3MKH can be used by configuring the ADC module and using the ADC API provided in the device's software development kit (SDK).
  • The power consumption of the S912ZVML12F3MKH varies depending on the operating mode and frequency. Refer to the device's datasheet for detailed power consumption specifications.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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