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S9S12XS256J0CAE - NXP

Description: Microcontrollers

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PCB Footprints
S9S12XS256J0CAE - NXP PCB footprint - Other - Other - QFP65P1720X1720X245-80N
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3D Models
S9S12XS256J0CAE - NXP  - 3D model - Other - QFP65P1720X1720X245-80N
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S9S12XS256J0CAE Details

  • Manufacturer Part Number:

    S9S12XS256J0CAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    CPU12

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    44

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    12288

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Speed:

    40 MHz

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max:

    1.98 V

  • Supply Voltage-Min:

    1.72 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

S9S12XS256J0CAE Frequently Asked Questions (FAQs)

  • The S9S12XS256J0CAE has an operating temperature range of -40°C to 125°C.
  • The clock settings for the S9S12XS256J0CAE can be configured using the Clock Generation Module (CGM) and the Oscillator Module (OSC). Refer to the device's reference manual for detailed instructions.
  • The S9S12XS256J0CAE has a maximum CPU frequency of 50 MHz.
  • The S9S12XS256J0CAE has a typical active mode current consumption of 10 mA at 50 MHz, and a typical sleep mode current consumption of 10 μA.
  • The S9S12XS256J0CAE has several communication interfaces, including two SCI (Serial Communication Interface) modules, one SPI (Serial Peripheral Interface) module, and one I2C (Inter-Integrated Circuit) module.

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S9S12XS256J0CAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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