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SA56004AD,118 - NXP

Description: Board Mount Temperature Sensors I2C LOC +/- 2OC AND

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Symbol
SA56004AD,118 - NXP - PCB symbol
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PCB Footprints
SA56004AD,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT96-1_2022
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3D Models
SA56004AD,118 - NXP - 3D model - Small Outline Packages - SOT96-1_2022
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SA56004AD,118 Details

  • Manufacturer Part Number:

    SA56004AD,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Accuracy-Max (Cel):

    1 Cel

  • Body Breadth:

    3.9 mm

  • Body Height:

    1.35 mm

  • Body Length or Diameter:

    4.9 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    11

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Termination Type:

    SOLDER

SA56004AD,118 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and avoid vias under the device.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and ensure good grounding. Also, use a common-mode choke or ferrite bead on the input lines to reduce EMI.
  • The SA56004AD can operate from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal management to prevent overheating.
  • Yes, but ensure the device is properly secured to the PCB using a suitable adhesive or mechanical fastening. Also, consider using a vibration-dampening material or potting compound to reduce stress on the device.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals. Check the power supply voltage, decoupling capacitors, and PCB layout for any issues. Consult the datasheet and application notes for troubleshooting guidelines.

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SA56004AD,118 Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like SA560, or try a keyword search, such as Temperature Sensors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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