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SA58631TK - NXP

Description: Audio Amplifiers 3 W BTL audio amplifier plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mmSOT909-1

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Symbol
SA58631TK - NXP - PCB symbol
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PCB Footprints
SA58631TK - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT909-1
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3D Models
SA58631TK - NXP - 3D model - Small Outline No-lead - SOT909-1
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SA58631TK Details

  • Manufacturer Part Number:

    SA58631TK

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-229, SOT909-1, HVSON-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    30 dB

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.15,32

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

SA58631TK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11024, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To minimize power consumption, configure the device to use the lowest possible supply voltage (VCC) and adjust the bias current (IBC) to the minimum required for the application. Additionally, use the power-down mode (PD) and disable unnecessary blocks when not in use.
  • The SA58631TK is rated for operation from -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal management and heat sinking to maintain a safe operating temperature.
  • Common issues like oscillation or instability can be caused by improper PCB layout, inadequate decoupling, or incorrect component values. Check the application note AN11024 for troubleshooting guidelines and use tools like a spectrum analyzer or oscilloscope to identify and resolve the issue.
  • The recommended values for external components can be found in the datasheet and application note AN11024. These values are optimized for the device's performance and should be used as a starting point for design. However, the final values may need to be adjusted based on the specific application and PCB layout.

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SA58631TK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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