SA58637BS,118 - NXP

SA58637BS,118 Details

• Manufacturer Part Number:

  SA58637BS,118

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  QFN

• Package Description:

  6 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT910-1, HVQFN-20

• Pin Count:

  20

• Manufacturer Package Code:

  SOT910-1

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Bandwidth-Nom:

  20 kHz

• Consumer IC Type:

  AUDIO AMPLIFIER

• JESD-30 Code:

  R-PQCC-N20

• JESD-609 Code:

  e4

• Length:

  6 mm

• Moisture Sensitivity Level:

  1

• Number of Channels:

  2

• Number of Functions:

  1

• Number of Terminals:

  20

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output Power-Nom:

  2.2 W

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC20,.2X.24,32

• Package Shape:

  RECTANGULAR

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1 mm

• Supply Current-Max:

  22 mA

• Supply Voltage-Max (Vsup):

  18 V

• Supply Voltage-Min (Vsup):

  2.2 V

• Surface Mount:

  YES

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  NICKEL PALLADIUM GOLD

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  5 mm