SA612AD/01,118 - NXP

SA612AD/01,118 Details

• Manufacturer Part Number:

  SA612AD/01,118

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  SOIC

• Package Description:

  SSOP-8

• Pin Count:

  8

• Manufacturer Package Code:

  SOT96-1

• Country Of Origin:

  Thailand

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• JESD-30 Code:

  R-PDSO-G8

• JESD-609 Code:

  e4

• Length:

  4.9 mm

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LSSOP

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.75 mm

• Supply Voltage-Nom:

  3 V

• Surface Mount:

  YES

• Telecom IC Type:

  TELECOM CIRCUIT

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  3.9 mm