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SAK-C167CR-LMHA+ - Infineon

Description: MICROCONTROLLER, 16-BIT, C166 CPU, 25MHZ, CMOS, PQFP144

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SAK-C167CR-LMHA+ - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - P-MQFP-144-8
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SAK-C167CR-LMHA+ - Infineon  - 3D model - Quad Flat Packages - P-MQFP-144-8
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SAK-C167CR-LMHA+ Details

  • Manufacturer Part Number:

    SAK-C167CR-LMHA+

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    PLASTIC, MQFP-144

  • Pin Count:

    144

  • HTS Code:

    8542.31.00.20

  • Date Of Intro:

    1993-05-01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    16

  • CPU Family:

    C166

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    111

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP144,1.2SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    2048

  • Seated Height-Max:

    2.75 mm

  • Speed:

    25 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

SAK-C167CR-LMHA+ Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 5 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and consider using a heat sink with a thermal resistance of less than 10 K/W.
  • Power up the device in the following sequence: VCC, VDD, and then VBAT. Ensure that VCC and VDD are powered up simultaneously, and VBAT is powered up last.
  • Use the device's built-in power-saving modes, such as the STOP mode, to reduce power consumption. Ensure that the device is properly configured and that all necessary peripherals are disabled before entering a power-saving mode.
  • Use X7R or X5R ceramic capacitors with a capacitance of 100 nF to 1 μF, and a voltage rating of 10 V to 16 V. Place the decoupling capacitors as close as possible to the device's power pins.

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SAK-C167CR-LMHA+ Overview

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