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SAL-TC367DP-64F300SAA - Infineon

Description: TC36x 32-Bit Single-Chip Microcontroller AA-Step 32-Bit Single-Chip Microcontroller

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PCB Footprints
SAL-TC367DP-64F300SAA - Infineon PCB footprint - BGA - BGA - LFBGA-292
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3D Models
SAL-TC367DP-64F300SAA - Infineon  - 3D model - BGA - LFBGA-292
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SAL-TC367DP-64F300SAA Details

  • Manufacturer Part Number:

    SAL-TC367DP-64F300SAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFBGA-292

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Date Of Intro:

    2020-01-02

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES AT 5V NOM SUPPLY

  • Bit Size:

    32

  • Clock Frequency-Max:

    160 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B292

  • JESD-609 Code:

    e2

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    292

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    300 MHz

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

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SAL-TC367DP-64F300SAA Overview

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