SAM9X60-V/DWB - Microchip

SAM9X60-V/DWB Details

• Manufacturer Part Number:

  SAM9X60-V/DWB

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-228

• Pin Count:

  228

• Manufacturer Package Code:

  TFBGA-228

• Country Of Origin:

  Taiwan

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  8 Weeks

• Date Of Intro:

  2019-09-24

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  19

• Address Bus Width:

  26

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  48 MHz

• External Data Bus Width:

  32

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B228

• Length:

  11 mm

• Low Power Mode:

  YES

• Number of DMA Channels:

  16

• Number of External Interrupts:

  1

• Number of Serial I/Os:

  16

• Number of Terminals:

  228

• On Chip Data RAM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA228,16X16,25

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• RAM (words):

  69632

• Seated Height-Max:

  1.2 mm

• Speed:

  600 MHz

• Supply Current-Max:

  14 mA

• Supply Voltage-Max:

  1.21 V

• Supply Voltage-Min:

  1.02 V

• Supply Voltage-Nom:

  1.15 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  BOTTOM

• Width:

  11 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC