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SAM9X75D2G-I/4TB - Microchip

Description: ARM926EJ-S Microprocessor IC SAM9X7 1 Core, 32-Bit 800MHz 243-TFBGA (16x16)Voltage - I/O 1.8V, 2.5V, 3.3V -40°C ~ 85°C (TA)

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Symbol
SAM9X75D2G-I/4TB - Microchip - PCB symbol
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PCB Footprints
SAM9X75D2G-I/4TB - Microchip PCB footprint - BGA - BGA - 243-Ball Thin Fine-Pitch Ball Grid Array (4TB) - 16x16x1.23 mm Body [TFBGA]
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3D Models
SAM9X75D2G-I/4TB - Microchip - 3D model - BGA - 243-Ball Thin Fine-Pitch Ball Grid Array (4TB) - 16x16x1.23 mm Body [TFBGA]
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SAM9X75D2G-I/4TB Details

  • Manufacturer Part Number:

    SAM9X75D2G-I/4TB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    243

  • Manufacturer Package Code:

    TFBGA-243

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • uPs/uCs/Peripheral ICs Type:

    SoC

SAM9X75D2G-I/4TB Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the SAM9X75D2G-I/4TB is -40°C to +85°C.
  • The clock system on the SAM9X75D2G-I/4TB can be configured using the Clock Controller (CKGR) and the Power Management Controller (PMC). Refer to the datasheet and the AT91SAM9X75 datasheet for more information.
  • The maximum frequency of the main clock (MCK) on the SAM9X75D2G-I/4TB is 400 MHz.
  • The SAM9X75D2G-I/4TB has a USB 2.0 high-speed interface. To use it, you need to configure the USB controller, enable the USB clock, and implement the USB protocol using the USB device or host controller drivers.
  • The SAM9X75D2G-I/4TB can connect up to 4 GB of external memory using the External Bus Interface (EBI).

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SAM9X75D2G-I/4TB Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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