Description:Schottky Barrier Chip
Guard Ring Die Construction for Transient Protection
Ideally Suited for Automatic Assembly
Low Power Loss, High Efficiency
Surge Overload Rating to 25A Peak
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Application
High Temperature Soldering: 260C/10 Second at Terminal
Lead Free Finish, RoHS Compliant (Note 3)
Diodes Incorporated recommends a PCB layout with a thermal pad connected to a large copper area on the top and bottom layers to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
Although the datasheet doesn't specify a maximum input voltage, it's recommended to limit the input voltage to 5V to prevent damage to the internal ESD protection diodes.
Yes, the SB180-T is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's requirements are within the device's capabilities.
To prevent ESD damage, handle the SB180-T with ESD-protective equipment, such as wrist straps and mats. During assembly, ensure that the device is not exposed to ESD-sensitive areas, and follow proper ESD-handling procedures.
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SB180-T Overview
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