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SBF720T1G - onsemi

Description: Pb-Free Packages are Available; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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Symbol
SBF720T1G - onsemi - PCB symbol
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PCB Footprints
SBF720T1G - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223 ST SUFFIX CASE 318E-04 ISSUE N
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3D Models
SBF720T1G - onsemi - 3D model - SOT223 (3-Pin) - SOT-223 ST SUFFIX CASE 318E-04 ISSUE N
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SBF720T1G Details

  • Manufacturer Part Number:

    SBF720T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223 (TO-261) 4 LEAD

  • Pin Count:

    4

  • Manufacturer Package Code:

    0.0318

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.75

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    300 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JEDEC-95 Code:

    TO-261AA

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    1.5 W

  • Power Dissipation-Max (Abs):

    1.5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    60 MHz

SBF720T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal via array under the package is recommended. The thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a reliable cooling system, such as a heat sink or fan, to maintain a safe operating temperature. Monitor the device's temperature using the thermal monitoring pin (TMP) and take corrective action if the temperature exceeds the recommended range.
  • The SBF720T1G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or handling the device in a way that could generate static electricity.
  • Yes, the SBF720T1G is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard for automotive applications and is manufactured using a robust process that ensures high reliability. However, it is essential to follow the recommended application guidelines and testing procedures to ensure the device meets the specific requirements of your application.
  • Start by reviewing the datasheet and application notes to ensure that the device is used within the recommended operating conditions. Check the device's pinout and connections to ensure they are correct. Use a logic analyzer or oscilloscope to monitor the device's signals and identify any anomalies. If the issue persists, contact onsemi's technical support for further assistance.

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SBF720T1G Overview

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