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SBR10200CTFP - Diodes Incorporated

Description: Schottky Diodes & Rectifiers 10A 200V

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PCB Footprints
SBR10200CTFP - Diodes Incorporated PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - ITO-220AB
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3D Models
SBR10200CTFP - Diodes Incorporated  - 3D model - Transistor Outline, Vertical - ITO-220AB
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SBR10200CTFP Details

  • Manufacturer Part Number:

    SBR10200CTFP

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TO-220AB

  • Package Description:

    ITO-220AB, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    FAST SOFT RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.74 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    110 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.02 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

SBR10200CTFP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SBR10200CTFP is a standard SOD-123 package footprint with a pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable operation of SBR10200CTFP in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and airflow, and ensuring that the device is operated within its specified temperature range.
  • The maximum allowable voltage stress for SBR10200CTFP is 100V, and it is recommended to operate the device within its specified voltage range to ensure reliable operation.
  • To handle ESD protection for SBR10200CTFP, it is recommended to follow proper ESD handling procedures, such as using ESD-safe materials and equipment, and ensuring that the device is properly grounded during handling and assembly.
  • The recommended storage condition for SBR10200CTFP is in a dry, cool place, away from direct sunlight and moisture, and in its original packaging or an ESD-safe container.

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SBR10200CTFP Overview

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