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SBR2U100LP-7 - Diodes Incorporated

Description: Diode 100 V 1.5A Surface Mount X1-DFN1411-3 850 mV @ 1.5 A 50 µA @ 100 V

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SBR2U100LP-7 - Diodes Incorporated - PCB symbol
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PCB Footprints
SBR2U100LP-7 - Diodes Incorporated PCB footprint - Other - Other - X1-DFN1411-3_2025-3
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3D Models
SBR2U100LP-7 - Diodes Incorporated - 3D model - Other - X1-DFN1411-3_2025-3
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SBR2U100LP-7 Details

  • Manufacturer Part Number:

    SBR2U100LP-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY

  • Application:

    FAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.85 V

  • JESD-30 Code:

    R-PBCC-N3

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    18 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

SBR2U100LP-7 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SBR2U100LP-7 is a standard SOD-123 package footprint with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal management system, and ensure good thermal conductivity between the device and the PCB.
  • Yes, the SBR2U100LP-7 is suitable for high-frequency switching applications up to 100 kHz. However, it is recommended to follow the recommended operating conditions and ensure proper PCB layout and decoupling to minimize electromagnetic interference (EMI).
  • Handle the SBR2U100LP-7 by the body, avoid touching the leads or die, and store them in a dry, cool place away from direct sunlight. Use anti-static packaging and follow standard ESD handling procedures to prevent damage.
  • The recommended soldering profile for the SBR2U100LP-7 is a peak temperature of 260°C for 10 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.

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SBR2U100LP-7 Overview

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