SBR2U30SA-13 - Diodes Incorporated

SBR2U30SA-13 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR2U30SA-13?
  The recommended PCB footprint for the SBR2U30SA-13 is a standard SOD-123 package footprint with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
• How do I ensure the SBR2U30SA-13 can handle high-frequency switching?
  To ensure the SBR2U30SA-13 can handle high-frequency switching, it's recommended to use a low-ESR capacitor (e.g., ceramic or film capacitor) with a value of 10nF to 100nF in parallel with the Schottky diode, and to minimize the PCB trace inductance and resistance.
• What is the maximum allowable voltage for the SBR2U30SA-13?
  The maximum allowable voltage for the SBR2U30SA-13 is 30V, but it's recommended to operate the device within the specified maximum repetitive reverse voltage (Vrrm) of 30V to ensure reliable operation.
• Can I use the SBR2U30SA-13 in a high-temperature environment?
  The SBR2U30SA-13 is rated for operation up to 150°C, but it's recommended to derate the device's current rating and voltage rating according to the temperature derating curve provided in the datasheet to ensure reliable operation.
• How do I calculate the power dissipation of the SBR2U30SA-13?
  The power dissipation of the SBR2U30SA-13 can be calculated using the formula: Pd = (Vf x If) + (Vr x Ir), where Vf is the forward voltage drop, If is the forward current, Vr is the reverse voltage, and Ir is the reverse current.