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SBRS8130LNT3G - onsemi

Description: Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, TJ = 25 °C); Small Compact Surface Mountable Package with J-Bend Leads; Highly Stable Oxide Passivated Junction; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 2500 units per

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SBRS8130LNT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SBRS8130LNT3G
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SBRS8130LNT3G - onsemi  - 3D model - Diodes Moulded - SBRS8130LNT3G
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SBRS8130LNT3G Details

  • Manufacturer Part Number:

    SBRS8130LNT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB-2

  • Package Description:

    SMB, 2 PIN

  • Manufacturer Package Code:

    403A-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.445 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    1000 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SBRS8130LNT3G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and provide adequate heat sinking and airflow around the device.
  • The recommended soldering conditions for the SBRS8130LNT3G are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.
  • Yes, the SBRS8130LNT3G is designed to withstand high-vibration environments. However, it's essential to follow proper mounting and soldering techniques to ensure the device remains securely attached to the PCB.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors. Ensure that the input voltage is within the recommended range, the output load is within the specified current limit, and the feedback resistors are correctly configured.

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SBRS8130LNT3G Overview

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