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SC16IS741AIPW - NXP

Description: TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

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SC16IS741AIPW - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
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SC16IS741AIPW - NXP  - 3D model - Small Outline Packages - TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for SC16IS741AIPW
  • Part Number SC16IS741AIPW
  • Manufacturer NXP
  • Pin Count 16
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
  • Released Date Dec 24, 2024
  • Last Modified Date Dec 24, 2024 4:53 AM UTC
  • Pinout / Pin List Click Here (Member Only)

SC16IS741AIPW Details

  • Manufacturer Part Number:

    SC16IS741AIPW

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSSOP-16

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Additional Feature:

    IT ALSO OPERATES AT 48MHZ CLCK @ 2.5V NOM SPLY @ -40 TO 85DEGC, SPI INTRFC IS ALSO AVAILABLE

  • Boundary Scan:

    NO

  • Bus Compatibility:

    I2C; RS485; RS232

  • Clock Frequency-Max:

    80 MHz

  • Communication Protocol:

    MIL STD 1553A; MIL STD 1553B

  • Data Transfer Rate-Max:

    0.625 MBps

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS

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SC16IS741AIPW Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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