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SC620ULTRT - SEMTECH

Description: Semtech SC620ULTRT, LED Driver 8-Segments, 16-Pin MLPQ UT

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PCB Footprints
SC620ULTRT - SEMTECH PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MLPQ-UT-16 3x3
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3D Models
SC620ULTRT - SEMTECH  - 3D model - Quad Flat No-Lead - MLPQ-UT-16 3x3
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SC620ULTRT Details

  • Manufacturer Part Number:

    SC620ULTRT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    3 X 3 MM, 0.60 MM HEIGHT, ROHS COMPLIANT, MLPQ-16

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Semtech Corporation

  • YTEOL:

    7

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    8

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

  • fmax-Min:

    0.44 MHz

SC620ULTRT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use a low-ESR capacitor for the output filter.
  • Monitor the input voltage, output current, and junction temperature to ensure they are within the specified limits. Use thermal design and layout techniques to minimize thermal resistance and ensure adequate heat dissipation.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended, with a voltage rating of at least 1.5 times the maximum input voltage. The capacitor should be placed close to the VIN pin.
  • Use a low-ESR capacitor (e.g., 10uF to 22uF X5R or X7R ceramic) and a low-inductance inductor (e.g., 1uH to 2.2uH). The output filter should be designed to minimize ripple and ensure the output voltage is within the specified range.
  • Use a thermal pad or thermal interface material (TIM) to improve heat transfer between the IC and the PCB. Ensure good airflow around the IC, and consider using a heat sink or thermal shield if necessary.

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