SC68376BGCAB25 - NXP

SC68376BGCAB25 Details

• Manufacturer Part Number:

  SC68376BGCAB25

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  End Of Life

• Package Description:

  QFP-160

• ECCN Code:

  EAR99

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  18 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  YES

• Address Bus Width:

  24

• Bit Size:

  32

• Boundary Scan:

  NO

• CPU Family:

  68000

• Clock Frequency-Max:

  20.97 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• External Data Bus Width:

  16

• Format:

  FIXED POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PQFP-G160

• Length:

  28 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of External Interrupts:

  7

• Number of I/O Lines:

  47

• Number of Serial I/Os:

  1

• Number of Terminals:

  160

• Number of Timers:

  22

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  QFP

• Package Equivalence Code:

  QFP160,1.2SQ

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK

• Peak Reflow Temperature (Cel):

  245

• RAM (bytes):

  4096

• ROM (words):

  8192

• ROM Programmability:

  MROM

• Seated Height-Max:

  3.85 mm

• Speed:

  20.97 MHz

• Supply Current-Max:

  160 mA

• Supply Voltage-Max:

  5.25 V

• Supply Voltage-Min:

  5 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  HCMOS

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  28 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER