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SCC2691AC1A28 - NXP

Description: • Full-duplex asynchronous receiver/transmitter • Quadruple buffered receiver data register • Programmable data format: – 5 to 8 data bits plus parity – Odd, even, no parity or force parity – 1, 1.5 or 2 stop bits programmable in 1/16-bit increments • 16-bit programmable Counter/Timer • Baud rate for the receiver and transmitter selectable from: – 22 fixed rates: 50 to 115.2K baud – Non-standard rates to 115.2 kb – Non-standard user-defined rate derived from programmable timer/ counter – Externa

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SCC2691AC1A28 - NXP PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - PLCC28: plastic leaded chip carrier; 28 leads-
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for SCC2691AC1A28
  • Part Number SCC2691AC1A28
  • Manufacturer NXP
  • Pin Count 28
  • Part Category Integrated Circuit
  • Package Category Plastic Leaded Chip Carrier
  • Footprint Name Plastic Leaded Chip Carrier - PLCC28: plastic leaded chip carrier; 28 leads-
  • Released Date Mar 22, 2025
  • Last Modified Date Mar 22, 2025 11:18 AM UTC
  • Pinout / Pin List Click Here (Member Only)

SCC2691AC1A28 Details

  • Manufacturer Part Number:

    SCC2691AC1A28

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LCC

  • Package Description:

    PLASTIC, MS-018, SOT-261-2, LCC-28

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    3

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    4 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.0046875 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PQCC-J28

  • JESD-609 Code:

    e3

  • Length:

    11.505 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    1

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC28,.5SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • RAM (words):

    0

  • Seated Height-Max:

    4.57 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.505 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SCC2691AC1A28 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
  • Implement a robust power-on reset circuit, ensure a stable clock signal, and consider using a temperature sensor to monitor and adjust system performance accordingly.
  • Use a shielded enclosure, ensure proper grounding and decoupling, and implement EMI filters on I/O lines. Follow NXP's application notes and guidelines for EMI and EMC compliance.
  • Use the device's power-down modes, optimize clock frequencies, and minimize I/O activity. Consider using a power management IC to regulate voltage and current.
  • Perform functional testing, boundary scan testing, and environmental testing (temperature, humidity, vibration). Validate the device's performance using NXP's recommended test vectors and procedures.

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SCC2691AC1A28 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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