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SCC2692AC1N40 - NXP

Description: NXP - SCC2692AC1N40 - UART Interface, 2 Channel, 1 Mbps, 4.5 V, 5.5 V, DIP, 40 Pins

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PCB Footprints
SCC2692AC1N40 - NXP PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
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3D Models
SCC2692AC1N40 - NXP  - 3D model - Dual-In-Line Packages - DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for SCC2692AC1N40
  • Part Number SCC2692AC1N40
  • Manufacturer NXP
  • Pin Count 40
  • Part Category Integrated Circuit
  • Package Category Dual-In-Line Packages
  • Footprint Name Dual-In-Line Packages - DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
  • Released Date Aug 18, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

SCC2692AC1N40 Details

  • Manufacturer Part Number:

    SCC2692AC1N40

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.600 INCH, PLASTIC, DIP-40

  • Pin Count:

    40

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    4

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    3.6864 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PDIP-T40

  • JESD-609 Code:

    e2

  • Length:

    52 mm

  • Low Power Mode:

    YES

  • Number of I/O Lines:

    15

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP40,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • RAM (words):

    0

  • Seated Height-Max:

    4.7 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN SILVER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SCC2692AC1N40 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
  • Implement a robust thermal management system, ensure proper PCB design, and follow NXP's recommended operating conditions. Consider using thermal interface materials and heat sinks if necessary.
  • Monitor the device's junction temperature, output voltage, and current. Implement over-temperature protection, over-current protection, and under-voltage lockout to ensure reliable operation.
  • Use the device's power-saving modes, optimize the switching frequency, and minimize the output voltage. Consider using a low-dropout regulator or a DC-DC converter for further power reduction.
  • Use a shielded enclosure, implement a Faraday cage, and add EMI filters to the input and output lines. Ensure proper PCB layout, decoupling, and grounding to minimize radiated emissions.

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SCC2692AC1N40 Overview

Use the download button to access the SCC2692AC1N40 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SCC26, or try a keyword search, such as Serial IO/Communication Controllers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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