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SCC2698BC1A84,512 - NXP

Description: NXP SCC2698BC1A84,512 8-channel Universal Asynchronous Receiver & Transmitter 0.115MBd, 5 V, 84-Pin, PLCC

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SCC2698BC1A84,512 - NXP PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - PLCC84
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SCC2698BC1A84,512 Details

  • Manufacturer Part Number:

    SCC2698BC1A84,512

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LCC

  • Package Description:

    PLASTIC, MS-018, SOT-189-2, LCC-84

  • Pin Count:

    84

  • Manufacturer Package Code:

    SOT189-2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    6

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    4 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PQCC-J84

  • JESD-609 Code:

    e3

  • Length:

    29.31 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    84

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC84,1.2SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • RAM (words):

    0

  • Seated Height-Max:

    4.57 mm

  • Supply Current-Max:

    30 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    29.31 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SCC2698BC1A84,512 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a reliable communication protocol like SPI or I2C, and ensure proper signal termination and shielding. Also, implement error checking and correction mechanisms to handle data transmission errors.
  • The SCC2698 has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Also, follow the recommended PCB thermal design guidelines.
  • Use the power-down modes (e.g., sleep mode) when the device is not in use. Optimize the clock frequency, use a low-power oscillator, and minimize the number of active circuits. Also, consider using a low-dropout regulator (LDO) for power supply.
  • Use ESD protection devices (e.g., TVS diodes) on the input/output pins to protect against electrostatic discharge. Follow the recommended PCB layout guidelines for ESD protection, and ensure that the device is handled and stored in an ESD-safe environment.

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SCC2698BC1A84,512 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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