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SCC68692C1N40,602 - NXP

Description: Dual asynchronous receiver/transmitter 40-Pin (600 mils wide) Plastic Dual In-Line Package (DIP) SOT129-1, +5 V ± 10 %, 0 to +70 °C

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SCC68692C1N40,602 - NXP PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - SOT129
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SCC68692C1N40,602 - NXP  - 3D model - Dual-In-Line Packages - SOT129
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SCC68692C1N40,602 Details

  • Manufacturer Part Number:

    SCC68692C1N40,602

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.600 INCH, MO-015, SOT-129-1, DIP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    SOT129-1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    4

  • Boundary Scan:

    NO

  • Bus Compatibility:

    S68000

  • Clock Frequency-Max:

    4 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PDIP-T40

  • JESD-609 Code:

    e3

  • Length:

    52 mm

  • Low Power Mode:

    YES

  • Number of I/O Lines:

    14

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP40,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (words):

    0

  • Seated Height-Max:

    4.7 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    15.24 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SCC68692C1N40,602 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in their application note AN11529, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The SCC68692C1N40,602 has a thermal pad that must be connected to a solid ground plane to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink. NXP recommends a maximum junction temperature of 150°C.
  • The recommended power-up sequence is to apply VCC first, followed by VIO, and then the clock signal. This ensures that the internal voltage regulators are properly initialized and the device is configured correctly.
  • NXP provides a troubleshooting guide for I2C interface issues in their application note AN10216. Common issues include incorrect pull-up resistor values, bus contention, and clock stretching. Use a logic analyzer or oscilloscope to debug the I2C signals.
  • The SCC68692C1N40,602 can operate up to 40 MHz, but the maximum frequency depends on the specific application and system design. NXP recommends consulting their application notes and design guides for specific frequency recommendations.

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SCC68692C1N40,602 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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