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SCT011H75G3AG - STMicroelectronics

Description: Automotive-grade silicon carbide Power MOSFET 750 V, 11.4 mΩ typ., 110 A in an H²PAK-7 package

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SCT011H75G3AG - STMicroelectronics - PCB symbol
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SCT011H75G3AG - STMicroelectronics PCB footprint - Other - Other - H²PAK-7_2024
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SCT011H75G3AG - STMicroelectronics - 3D model - Other - H²PAK-7_2024
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SCT011H75G3AG Details

  • Manufacturer Part Number:

    SCT011H75G3AG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Italy

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    32 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    750 V

  • Drain Current-Max (ID):

    110 A

  • Drain-source On Resistance-Max:

    0.015 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    33.6 pF

  • JESD-30 Code:

    R-PSSO-G7

  • Number of Elements:

    1

  • Number of Terminals:

    7

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    652 W

  • Pulsed Drain Current-Max (IDM):

    489 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

SCT011H75G3AG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the SCT011H75G3AG near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure a minimum of 1mm clearance around the device for airflow.
  • To ensure reliable operation at high temperatures, ensure that the SCT011H75G3AG is operated within its specified temperature range (-40°C to 150°C). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Also, consider using a thermocouple or thermistor to monitor the device temperature.
  • When handling the SCT011H75G3AG, take precautions to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat, and handle the device by the body or pins, avoiding touching the die. Also, avoid exposing the device to moisture, and store it in a dry, cool place.
  • To troubleshoot issues with the SCT011H75G3AG, start by checking the device's pinout and connections. Verify that the device is properly powered and that the input and output pins are correctly connected. Use a multimeter or oscilloscope to measure voltage and current levels. Check for signs of overheating, and ensure that the device is operated within its specified temperature range.
  • When using the SCT011H75G3AG in a high-reliability application, consider the device's failure modes and effects analysis (FMEA). Ensure that the device is operated within its specified parameters, and that it is properly derated for voltage, current, and temperature. Use a suitable qualification plan, and consider using redundant or fault-tolerant designs.

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SCT011H75G3AG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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