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SCT020H120G3AG - STMicroelectronics

Description: Automotive-grade silicon carbide Power MOSFET 1200 V, 18.5 mΩ typ., 100 A in an H²PAK-7 package

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SCT020H120G3AG - STMicroelectronics - PCB symbol
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PCB Footprints
SCT020H120G3AG - STMicroelectronics PCB footprint - Other - Other - H²PAK-7
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3D Models
SCT020H120G3AG - STMicroelectronics - 3D model - Other - H²PAK-7
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SCT020H120G3AG Details

  • Manufacturer Part Number:

    SCT020H120G3AG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Italy

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    245

  • Terminal Finish:

    Matte Tin (Sn) - annealed

SCT020H120G3AG Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout and thermal management guidelines.
  • The maximum allowed voltage transient on the input pins is ±500 mV, with a duration of less than 100 ns, to prevent damage to the device.
  • Yes, the SCT020H120G3AG is AEC-Q101 qualified and suitable for high-reliability and automotive applications, but ensure compliance with relevant industry standards and regulations.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals, and check for proper power supply, decoupling, and PCB layout.

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SCT020H120G3AG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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