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SCT070HU120G3AG - STMicroelectronics

Description: Automotive-grade silicon carbide Power MOSFET 1200 V, 63 mΩ typ., 30 A in an HU3PAK package

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SCT070HU120G3AG - STMicroelectronics - PCB symbol
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PCB Footprints
SCT070HU120G3AG - STMicroelectronics PCB footprint - Other - Other - STHU32N65DM6AG-3
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3D Models
SCT070HU120G3AG - STMicroelectronics - 3D model - Other - STHU32N65DM6AG-3
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SCT070HU120G3AG Details

  • Manufacturer Part Number:

    SCT070HU120G3AG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    40 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SCT070HU120G3AG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current and voltage ratings at high temperatures.
  • The maximum allowed voltage transient on the input pins is ±20% of the rated voltage for a duration of ≤100ms. Exceeding this may damage the device.
  • Use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent ESD damage.
  • A soldering profile with a peak temperature of 240°C to 250°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s to 6°C/s is recommended.

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SCT070HU120G3AG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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