ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, and ensure good airflow around the device. ROHM also recommends derating the power dissipation according to the ambient temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C, and a dwell time of 10-30 seconds above 220°C. The device is compatible with lead-free soldering, and ROHM suggests following the JEDEC J-STD-020 standard for reflow soldering.
To prevent damage, store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. During shipping, use anti-static packaging materials, and avoid bending or flexing the leads. ROHM also recommends following the EIA/JESD625 standard for handling and storage of semiconductor devices.
ROHM recommends characterizing the device under the following test conditions: Vcc = 5V, Ta = 25°C, and RL = 10kΩ. Additionally, use a low-inductance test fixture, and ensure proper decoupling of the power supply lines.
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SCT3080ALHRC11 Overview
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