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SCT3120ALGC11 - ROHM Semiconductor

Description: MOSFET N-Ch 650V SiC 21A 120mOhm TrenchMOS

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SCT3120ALGC11 - ROHM Semiconductor - PCB symbol
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PCB Footprints
SCT3120ALGC11 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247N_2
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3D Models
SCT3120ALGC11 - ROHM Semiconductor - 3D model - Transistor Outline, Vertical - TO-247N_2
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SCT3120ALGC11 Details

  • Manufacturer Part Number:

    SCT3120ALGC11

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247N, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    27 Weeks

  • Date Of Intro:

    2017-03-13

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    21 A

  • Drain-source On Resistance-Max:

    0.156 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    265

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    52 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

SCT3120ALGC11 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a heat sink or thermal interface material, and ensure good airflow around the device. Also, consider derating the device's power dissipation according to the ambient temperature.
  • Use a reflow soldering process with a peak temperature of 240°C to 250°C, and a dwell time of 20-30 seconds. Avoid wave soldering or hand soldering, as it may damage the device.
  • Use ESD-safe materials, such as wrist straps, mats, and bags. Ground yourself before handling the device, and avoid touching the pins or leads. Use an ESD-protected workstation and follow proper handling procedures.
  • Operating the device beyond the recommended voltage range may lead to reduced reliability, increased power consumption, and potential damage to the device. Ensure the voltage supply is within the recommended range to ensure optimal performance and reliability.

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SCT3120ALGC11 Overview

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