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SCT3160KLGC11 - ROHM Semiconductor

Description: ROHM - SCT3160KLGC11 - Silicon Carbide Power MOSFET, N Channel, 17 A, 1.2 kV, 0.16 ohm, 18 V, 5.6 V

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PCB Footprints
SCT3160KLGC11 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247
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3D Models
SCT3160KLGC11 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-247
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SCT3160KLGC11 Details

  • Manufacturer Part Number:

    SCT3160KLGC11

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247N, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    27 Weeks

  • Date Of Intro:

    2017-03-13

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    17 A

  • Drain-source On Resistance-Max:

    0.208 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    18 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    265

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    103 W

  • Power Dissipation-Max (Abs):

    103 W

  • Pulsed Drain Current-Max (IDM):

    42 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

  • Turn-off Time-Max (toff):

    49 ns

  • Turn-on Time-Max (ton):

    32 ns

SCT3160KLGC11 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended for optimal thermal performance. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • The device requires a stable input voltage (VIN) and a proper bias voltage (VCC) to operate optimally. Ensure that VIN is within the recommended range (4.5V to 18V) and VCC is set to 5V ± 10% for optimal performance.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor (CIN). This value provides a good balance between noise filtering and stability.
  • The thermal shutdown feature is activated when the junction temperature exceeds 150°C. To handle this, ensure that your design includes a thermal monitoring mechanism, such as a temperature sensor, to detect and respond to thermal shutdown events.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the output capacitor (COUT). This value provides a good balance between output ripple and stability.

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